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NTMFS4934N
Power MOSFET
30 V, 147 A, Single N ? Channel, SO ? 8 FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? CPU Power Delivery, DC ? DC Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(ON) MAX
2.0 m W @ 10 V
3.0 m W @ 4.5 V
D (5,6)
I D MAX
147 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
Continuous Drain
Current R q JA
(Note 1)
Power Dissipation
R q JA (Note 1)
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
V GS
I D
P D
± 20
29.1
18.4
2.72
V
A
W
G (4)
S (1,2,3)
N ? CHANNEL MOSFET
Continuous Drain
Current R q JA ≤ 10 s
(Note 1)
Power Dissipation
R q JA ≤ 10 s (Note 1)
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Steady
State
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
I D
P D
I D
P D
47.5
30.0
7.23
17.1
10.8
0.93
A
W
A
W
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
S
S
S
G
MARKING
DIAGRAM
D
4934N
AYWZZ
D
D
D
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
Pulsed Drain Current
T C = 25 ° C
T C =100 ° C
T C = 25 ° C
T A = 25 ° C, t p = 10 m s
I D
P D
I DM
147
93
69.44
442
A
W
A
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Current Limited by Package
T A = 25 ° C
I Dmax
100
A
Operating Junction and Storage Temperature
T J ,
T STG
? 55 to
+150
° C
ORDERING INFORMATION
Source Current (Body Diode)
I S
68
A
Device
Package
Shipping ?
Drain to Source DV/DT dV/d t 6 V/ns
Single Pulse Drain ? to ? Source Avalanche E AS 205 mJ
Energy T J = 25 ° C, V DD = 24 V, V GS = 10 V,
I L = 37 A pk , L = 0.3 mH, R G = 25 W
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
NTMFS4934NT1G SO ? 8 FL 1500 /
(Pb ? Free) Tape & Reel
NTMFS4934NT3G SO ? 8 FL 5000 /
(Pb ? Free) Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 4
1
Publication Order Number:
NTMFS4934N/D
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